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Winbond: on the percentage of finished chips with 0.13 micron rates and other interesting facts
At present, the Taiwanese company Winbond Electronics is approaching a significant milestone for itself: in September, it is expected that the release of memory chips with 0.13 micron norms will equal in volume to the number of chips produced with the nomes of the previous 0.16 micron technical process.
A rare frankness for the industry: representatives of the company told about the yield of suitable chips from each 0.13 micron silicon wafer with a diameter of 200 mm. So, at present, the output from such a plate is about 240 usable DDR chips (in 256 Mbit equivalent), which is about a dozen chips less than the output when using the 0.16 micron process technology. It is expected that next month the 0.13 micron technical process will break out of the leaders, the yield of suitable chips on 0.13 micron wafers will reach about 70% (how the data on 240 chips and 70 percent compare, alas, is not specified). By the end of the year, the company intends to increase monthly production volumes to 10 thousand silicon wafers.
A few more interesting facts from the life of Winbond: at present, the production of chips with 0.16 micron rates makes up about 60% of all the company’s products. The technical process with 0.175 micron rates is now used only for the production of niche chips. 90% of all manufactured chips are DDR memory, of which 90% are DDR333 chips. Most interesting: up to 30% of DDR333 chips can meet DDR400 specifications (if / when they are finally adopted).