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Platform Conference 2021: Elpida on DDR II plans
We managed to get hold of the full 44-page presentation of Elpida presented at Platform Conference 2021. I will tell you the most curious document, because along with the company’s detailed plans for the release of chips and DDR I / DDR II memory modules, it includes specific characteristics of the upcoming PC2-4300 (DDR2-533) and PC2-5400 (DDR2- 667). Of course, within the framework of the news, only the most basic of this document can be transmitted. Let’s get started.
Mainly, the materials presented in the document relate to the release of PC-2700 (DDR-333) modules on chips in TSOP packages, as well as
characteristics of Registered DIMMs PC2-4300 (DDR2-533) and PC2-5400 (DDR2-667). However, if you approach from afar, it is worth giving the general roadmap of the company for the coming years.
As you can see, SDRAM will be discontinued by Elpida in the very near future, both in DIMM and SO-DIMM versions. In the near future the company intends to concentrate its attention on the release of PC2700 modules for desktop and mobile PCs; production of PC3200 modules will begin approximately in the second quarter. All of this applies to DDR I memory. As for the DDR II standard chips, the release of which the company intends to start in late 2021 – early 2021, there is clarity in the pinout of the new standard modules: 240-pin Registered DIMM DDR II SDRAM modules will be produced for the desktop PC market, for the market servers and workstations – 240-pin Unbuffered DDR II SDRAM DIMMs, for mobile devices – 200-pin SO-DIMMs and 244-pin Mini DIMMs DDR-II SDRAM.
According to the statements in the document, the company has already conducted test tests of 240-pin DIMM PC2-4300 (DDR2-533) modules and is ready for their production, now the whole thing “rests” on working with the standard and further certification of modules for specific platforms. Moreover, the first samples of DDR2 chips from Elpida, according to the document, correspond to the approximate characteristics of DDR2-667 chips.
In the above table, you can see that the company plans to release DDR2 chips with a capacity from 256 Mbit to 4 Gbit, and in the future it is scary to say, even 8 Gbit, which will result in a module with a capacity of 16 GB! Fiction… Packaging of DDR2 chips, as previously reported – 64-pin FBGA (µBGA) and 84-pin FBGA (µBGA) chips, one of the methods of packing chips into modules is the company promotes the TCP (Tape Carrier Package) method developed by it.