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ISSCC: Intel considers SoC unpromising

After analyzing the advantages and disadvantages of systems-on-a-chip, Intel representatives spoke at the International Solid-State Circuits conference with a message that they consider it inappropriate to further develop this technology due to the too high cost of additional steps of the technological process. Alternative three-dimensional So3D chips, as the company called them, are offered in exchange.

As we already reported, 3D microcircuits actually consist of several chips interconnected by microscopic conductors. In this case, different parts of the chip can have different purposes (for example, logic chip, DSP, analog device or memory). By the way, it is memory that is the main source of problems for industrialists: the market demand for single-chip devices with integrated memory is already high, and by 2021, by which it is planned to master the production of three-dimensional chips, there will be even more.

Representatives of Texas Instruments strongly objected to the opinion of Intel. The company believes that, given the experience in the development of microcircuits with combined digital and analog parts, special problems with the cost price of digital-to-analog microcircuits manufactured entirely in CMOS are not expected in the future.

Which approach turns out to be truly more beneficial, we have yet to find out.

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