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Xerox builds microscopic inductors and coil springs
Xerox Research Center (PARC) in Palo Alto, Calif., Announces the development of technology for creating self-organizing 3D structures on silicon wafers for microcircuits. The company demonstrated examples of the application of a technology called StressedMetal to create inductive elements on the surface of a chip and to apply conductors between elements.
The name of the technology comes from the fact that when creating elements, a thin layer of metal is used, stretched onto the surface and cut into strips, which, when mechanical stress is removed, rolls up into rings of a given radius.
PARC reports that the Q-factor of the inductive elements is at least 70 at 1 GHz when installed on a conventional CMOS (CMOS) chip. Due to the fact that the inductive element is located outside the crystal, its Q-factor is slightly higher, and the level of interference to neighboring elements located under it, respectively, is lower.
StressedMetal conductors used in a printhead prototype for the new PARC printer. The printhead uses an array of 200 diode lasers spaced 3 microns apart and requires microscopically small interconnect leads.